Production of double-sided or multi-layer PCB circuit board technology, is generally used

Drilling - Electroless Copper - Full Plate Thicker Copper Plating - Pattern Transfer - Circuit Copper Plating - Alkaline Etching - Production Process

The purpose of thickening the entire board is to increase the strength of the electroless copper layer.

As in the copper plating process, the current density distribution of non-uniform, will lead to the entire surface of the copper plate thickness uneven.

High current density part of the copper thickness;

The part with low current density has a small copper thickness.

In this way, during the alkaline time, if the etching is completed, the over-etching phenomenon occurs in the part with small thickness of copper.

A copper plating PCB production process

Drilling - Electroless Copper - Pattern Transfer - Circuit Copper Plating - Alkaline Etching

Shanghai Electronic Products Processing due to the absence of a full thick copper plating process, to avoid the aforementioned phenomenon of local over-eclipse.

At the same time, the corrosion of the copper layer is less than the thickness of the secondary copper plating process, so the whole plate can be better control of erosion phenomenon.